TEL CLEAN TRACK MARK Series

CLEAN TRACK MARK Vz
 - 3"-150mm Substrates
 - Single Wafer/Lot Control
 - Stacked Hot Plates
 - Vacuumless Twin Arm Transfer
 - User Friendly, Menu Driven Operator Interface

TEL’s CLEAN TRACK MARK Vz features a two tier hot plate system that reduces overall system footprint compared with competitive systems of its class. It is ideal for all substrates, including GaAs and other fragile materials.

TEL CLEAN TRACK MARK 7/8
 - 125-200mm Substrates
 - Single Wafer/Lot Control
 - Vacuumless Triple Arm Transfer
 - Four Tier Stacked Hot Plates
 - SECS I/II, GEM Compliant

The CLEAN TRACK MARK 7/8 triple arm transfer increases throughput over competing systems. Four tier stacked hot plates reduce system footprint while enhancing process control. Reduced chemical use makes this one of the lowest CoO systems available.