The
9X is designed to meet the requirements of advanced photoresist
process applications, from leading-edge CPU manufacturing to volume memory
manufacturing. Its 100mm – 200mm enhanced substrate handling, stacked
thermal modules and submicron
processing (down to 0.18um) capabilities, plus process control, and
contamination control features, make the 9X series ideal for high
productivity submicron manufacturing environments in DUV or I-line settings.
A key automation feature is the MultiPath™ substrate transfer system, maximizing throughput by combining serial and random transfer modes while eliminating bottle necks caused by lengthy process steps. MultiPath also eliminates process control problems by ensuring that serial arms are present for substrate transfer between critical process steps such as post-exposure bake to chill.
Optional features include the beltless exposure tool interface, photoresist and develop fluid temperature control, ambient temperature and humidity control, OEBR, SMIF and Polyimide Coat/Develop/Bake
The 9X delivers the performance required for submicron processing manufacturing applications via a flexible, compact configuration.