All 86 series systems are capable of processing 2"
through 150mm substrates. Wafer size change is simple
and requires minutes, not hours. Silicon, GaAs,
sapphire, GGG, Lithium Niobate, thin film heads, MEMS
and many other substrate types are routinely processed
on 86 Series systems. The 86 Series are even able to
process square substrates up to 125mm on a side (180mm
diagonal).
The 86 series uses a simple and very forgiving belt transfer system to reduce wafer breakage. This belted system has low transfer overhead times, resulting in high throughput on an in-line track system.