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Developer/DI Dispense (Eclipse)
- Reduction in developer and DI dispense by up to 50%.
- Reduce defect counts through improved rinsing mechanism.
- Improved rinsing on edge of 8’’ wafers, compared to dual stream.
- Uniform develop rates cross wafer.
Reduced process time up to 23%
150, 200 mm substrate
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Wafer-handling Passive Centering
- Available for all chill plates and all stages.
- Designed for 150mm and 200mm wafers.
- CP capture range of 9mm
Stage capture range of 6mm
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90-SE Coater Spindle
- Weight of spindle assembly reduced by 20%.
- Float introduced for lead nut to prevent binding.
- Rotation of lead nut prevented to improve repeatability.
- Super smart ball bushings able to self align.
- Quick disconnect for chuck vacuum.
90-SE only
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Dispense Arm – Improved Packaging
- x and z guide-rails replaced by precision linear guide rails.
- Internal wiring on motors.
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Coater Dispense Nozzle Tips
- Individually replaceable tips
- Molded parts as opposed to machined units.
- Easy and inexpensive to replace.
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Resist Dispense Tip Assy. Replacement
- Upgrade older 99-45456-02 coater dispense arms to accept the molded nozzle tips.
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Main Shuttle Improvement
- Add limit switches to determine number of steps between Switch 1 and Switch 2
- Second switch allows for calibration check during operation.
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