8X Track Systems

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88 Series

Available as: New and Remanufactured


The fully featured 88 Series is ideal for submicron manufacturing. All 88 series systems are capable of processing 3" through 150mm substrates. Wafer size change is simple and requires minutes, not hours. Silicon, GaAs, Sapphire, GGG, Lithium Niobate, thin film heads, MEMS and many other substrate types are routinely processed on 88 Series systems.

The 88 series uses an enhanced in-line robotic transfer arm between each module. Critical transfers, such as between soft bake and chill, are much more easily controlled compared to a totally random robotic system. The 88 series can be provided with enhanced handling features including ceramic transfer arms, substrate edge handling during transfer and padded transfer arms.

 

 

88 Series

Available as: 
New and Remanufactured


All 86 series systems are capable of processing 2" through 150mm substrates. Wafer size change is simple and requires minutes, not hours. Silicon, GaAs, sapphire, GGG, Lithium Niobate, thin film heads, MEMS and many other substrate types are routinely processed on 86 Series systems. The 86 Series are even able to process square substrates up to 125mm on a side (180mm diagonal).

The 86 series uses a simple and very forgiving belt transfer system to reduce wafer breakage. This belted system has low transfer overhead times, resulting in high throughput on an in-line track system.

 




  
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