The CLEAN TRACK MARK 7/8 triple arm transfer increase throughput over competing systems. Four tier stacked hot plates reduce system footprint while enhancing process control. Reduced chemical use makes this one of the lowest cost-of-ownership systems available.
- 125-200mm Substrates
- Single Wafer/Lot Control
- Vacuumless Triple Arm Transfer
- Four Tier Stacked Thermal Modules
- Random-Path Wafer Flows
- SECS I/II, GEM Compliant
A variety of Rite Track exclusive upgrades are available to extend the usefulness of the popular production system.
The 9X is designed to meet the requirement of advanced photoresist process applications, from leading-edge CPU manufacturing to volume memory manufacturing. Its 100mm – 200mm enhanced substrate handling, stacked thermal modules and submicron processing (down to 0.18um) capabilities, plus process control, and contamination control features, make the 9X series ideal for high productivity submicron manufacturing environments in DUV or I-line settings.
A key automation feature is the MultiPath™ substrate transfer system, maximizing throughput by combining serial and random transfer modes while eliminating bottle necks caused by lengthy process steps. MultiPath also eliminates process control problems by ensuring that serial arms are present for substrate transfer between critical process steps such as post-exposure bake to chill.
Rite Track 88e
The Rite Track 88e Track System, a Rite Track design based on the proven 88 Series platform, provides cost effective 200mm substrate processing capability with improved contamination control, reliability, and process control.
The Rite Track 88e Track System improves on the proven 88 series system by meeting the demanding requirements of 200mm processing while maintaining ease of repair and quick size changes from 100mm to 200mm.
All 88e modules are redesigned, not just "scaled-up", to ensure optimum performance at 200mm.