100mm - 200mm Processing



The 9X is designed to meet the requirement of advanced photoresist process applications, from leading-edge CPU manufacturing to volume memory manufacturing. Its 100mm – 200mm enhanced substrate handling, stacked thermal modules and submicron processing (down to 0.18um) capabilities, plus process control, and contamination control features, make the 9X series ideal for high productivity submicron manufacturing environments in DUV or I-line settings. 

A key automation feature is the MultiPath™ substrate transfer system, maximizing throughput by combining serial and random transfer modes while eliminating bottle necks caused by lengthy process steps.  MultiPath also eliminates process control problems by ensuring that serial arms are present for substrate transfer between critical process steps such as post-exposure bake to chill.

Optional features include the beltless exposure tool interface, photoresist and develop fluid temperature control, ambient temperature and humidity control, OEBR, SMIF and Polyimide Coat/Develop/Bake.

The 9X delivers the performance required for submicron processing manufacturing applications via a flexible, compact configuration.


The Rite Track 88e Track System, a Rite Track design based on the proven 88 Series platform, provides cost effective 200mm substrate processing capability with improved contamination control, reliability, and process control

The Rite Track 88e Track System improves on the proven 88 series system by meeting the demanding requirements of 200mm processing while maintaining ease of repair and quick size changes from 100mm to 200mm.

All 88e modules are redesigned, not just "scaled-up", to ensure optimum performance at 200mm.

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