• 125-200mm Substrates
• Single Wafer/Lot Control
• Four Tier Stacked Thermal Modules
• Vacuumless Triple Arm Transfer
• User Friendly, Menu Driven Operator Interface
• Random-Path Wafer Flows
• SECS I/II, GEM Compliant

The MARK 7/8 triple arm transfer increase throughput over competing systems. Four tier stacked hot plates reduce system footprint while enhancing process control. Reduced chemical use makes this one of the lowest cost-of-ownership systems available.

TEL MARK Vz / MARK VA

• 3"-150mm Substrates
• MK Vz: Up to 120 wph / MK VA Up to 90 wph
• Single Wafer/Lot Control
• Two Tier Stacked Thermal Modules
• Vacuumless Twin Arm Transfer
• User Friendly, Menu Driven Operator Interface
• Random-Path Wafer Flows

The MARK Vz features a two tier hot plate system that reduces overall system footprint compared with competitive systems of its class. It is ideal for all substrates, including GaAs and other fragile materials.