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MARK Series Track Systems

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Available as: Refurbished


        

TEL MARK 7/8

  • 125-200mm Substrates
  • Single Wafer/Lot Control
  • Four Tier Stacked Thermal Modules
  • Vacuumless Triple Arm Transfer
  • User Friendly, Menu Driven Operator Interface
  • Random-Path Wafer Flows
  • SECS I/II, GEM Compliant

The MARK 7/8 triple arm transfer increase throughput over competing systems. Four tier stacked hot plates reduce system footprint while enhancing process control. Reduced chemical use makes this one of the lowest cost-of-ownership systems available.


 

TEL MARK Vz

  • 3"-150mm Substrates
  • MK Vz: Up to 120 wph
  • Single Wafer/Lot Control
  • Two Tier Stacked Thermal Modules
  • Vacuumless Twin Arm Transfer
  • User Friendly, Menu Driven Operator Interface
  • Random-Path Wafer Flows

The MARK Vz features a two tier hot plate system that reduces overall system footprint compared with competitive systems of its class. It is ideal for all substrates, including GaAs and other fragile materials.


  
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