TEL MARK 7/8
- 125-200mm Substrates
- Single Wafer/Lot Control
- Four Tier Stacked Thermal Modules
- Vacuumless Triple Arm Transfer
- User Friendly, Menu Driven Operator Interface
- Random-Path Wafer Flows
- SECS I/II, GEM Compliant
The MARK 7/8 triple arm transfer increase throughput over competing systems. Four tier stacked hot plates reduce system footprint while enhancing process control. Reduced chemical use makes this one of the lowest CoO systems available.
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TEL Mark Vz / MARK VA
- 3"-150mm Substrates
- MK Vz: Up to 120 wph / MK VA Up to 90 wph
- Single Wafer/Lot Control
- Two Tier Stacked Thermal Modules
- Vacuumless Twin Arm Transfer
- User Friendly, Menu Driven Operator Interface
- Random-Path Wafer Flows
The MARK Vz features a two tier hot plate system that reduces overall system footprint compared with competitive systems of its class. It is ideal for all substrates, including GaAs and other fragile materials.
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